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Interface Chemistry and Dielectric Optimization of TMA-Passivated high-k/Ge Gate Stacks by ALD-Driven Laminated Interlayers  ( SCI-EXPANDED收录)   被引量:14

文献类型:期刊文献

英文题名:Interface Chemistry and Dielectric Optimization of TMA-Passivated high-k/Ge Gate Stacks by ALD-Driven Laminated Interlayers

作者:Wang, Die[1];He, Gang[1,2];Hao, Lin[1];Qiao, Lesheng[1];Fang, Zebo[3];Liu, Jiangwei[4]

机构:[1]Anhui Univ, Sch Phys & Mat Sci, Radiat Detect Mat & Devices Lab, Hefei 230601, Peoples R China;[2]Anhui Univ, Inst Phys Sci & Informat Technol, Hefei 230601, Peoples R China;[3]Shaoxing Univ, Sch Math Informat, Shaoxing 312000, Peoples R China;[4]Natl Inst Mat Sci NIMS, Res Ctr Funct Mat, Ibaraki 3050044, Japan

年份:2020

卷号:12

期号:22

起止页码:25390

外文期刊名:ACS APPLIED MATERIALS & INTERFACES

收录:SCI-EXPANDED(收录号:WOS:000538515700091)、、WOS

基金:The authors acknowledge the support from National Natural Science Foundation of China (11774001), open fund for Discipline Construction, Institute of Physical Science and Information Technology, Anhui University (S01003101).

语种:英文

外文关键词:high-k gate dielectric; atomic layer deposition; interface chemistry; passivation layer; electrical properties

外文摘要:In the present study, a comparative study on the influence of different laminated stacks driven by aomic layer deposition (ALD) on the interfacial and electrcial properties of high-k/Ge gate stacks passivated by trimethylaluminum (TMA) has been performed in detail via X-ray photo-electron spectroscopy (XPS) and electrical measurements. XPS measurements indicate that HfO2/Al2O3/Ge gate stacks can effectively inhibit the formation of Ge suboxides and a low-k germanate layer. Compared to Al2O3/HfO2 and HfO2/Al2O3/HfO2 gate stacks, the HfO2/Al2O3/Ge metal oxide semiconductor (MOS) capacitors exhibited improved electrical performance, including a maximum permittivity of 18.15, disappearing hysteresis, an almost neglected flat band voltage of 0.01 V, and a minimum leakage current density of 3.82 X 10-8 A/cm(2) at room temperature. Especially, the leakage current mechanisms of Ge-MOS capacitors based on different laminated stacks measured at room temperature and low temperature (77-327 K) have been comprehensively analyzed. By comparing three different laminated gate stacks, it can be inferred that HfO2/Al2O3 /Ge gate stacks have a potential application prospect in Ge-based microelectronic devices.

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