文献类型：期刊文献

英文题名：Construction of denser networks via functionalized aluminum oxide-boron nitride hybrid fillers: Towards improved thermal conductivity of polycarbonate composites

作者：Feng, Fang[1];Luo, Yongbiao[1];Yang, Ruyi[2];Zhao, Zhiheng[2]

机构：[1]Shaoxing Univ, Yuanpei Coll, Shaoxing, Peoples R China;[2]Xihua Univ, Sch Mat Sci & Engn, Chengdu 610039, Peoples R China

年份：2024

外文期刊名：POLYMER COMPOSITES

收录：SCI-EXPANDED(收录号：WOS:001310094400001)、、EI(收录号：20243717031942)、WOS

基金：Financial support of Liangshan Science and Technology Program (23ZDYF0008), and Sichuan Science and Technology Program (2022ZHCG0069).

语种：英文

外文关键词：aluminum oxide; boron nitride; hybrid filler; polymer-matrix composites; thermal conductivity

外文摘要：With the gradual acceleration of development in the modern electronics, there is a higher demand for insulating polymer composites with high thermal conductivity. Herein, the functionalized fillers were fabricated through first deposition of polydopamine (PDA) on boron nitride (BN) plates and then covalent modification of BN-PDA and aluminum oxide (Al2O3)by gamma-aminopropyltriethoxysilane(APTES), respectively. Hybridized filler-filled polycarbonate (PC) composites were prepared by partially substituting Al(2)O(3 )for BN plates with constant filler content. The PC composite filled with 9 wt% Al(2)O(3 )and 21 wt% BN (PCA3B7)achieved a thermal conductivity of 0.734 W mk(-1), which is 217% and 21% higher than that of pure PC (0.231 W mk(-1))and PCB(0.605Wmk(-1)), respectively. Besides, the PC composites exhibit excellent electrical insulation properties (10(13)Omega cm), relatively good mechanical properties, and enhanced thermal stability. This PC composite, characterized by its superior comprehensive performance, holds significant promise as a thermal management material in electrical and electronic device applications. Highlights center dot Functionalized fillers were fabricated via covalent and non-covalentmethods. center dot The appropriate proportion of hybridized fillers showed synergistic effects. center dot The composite's thermal conductivity was 217% higher than pure PC. center dot The composite exhibited desirable electrical insulating characteristics andthermal stability. center dot The composite could act as a thermal management material.