文献类型：期刊文献

英文题名：Preparation and Curing Behaviour of Epoxy Based Film for Moderate Temperature Prepreg

作者：Yao, Jiangwei[1];Zhan, Haihua[1];Zou, Zhuanyong[1]

机构：[1]Shaoxing Univ, Coll Text & Fash, Shaoxing, Peoples R China

年份：2017

卷号：25

期号：8

起止页码：621

外文期刊名：POLYMERS & POLYMER COMPOSITES

收录：SCI-EXPANDED(收录号：WOS:000407409800007)、、EI(收录号：20173404062180)、Scopus(收录号：2-s2.0-85027497800)、WOS

基金：The authors gratefully acknowledge financial support for this research from Science and Technology Bureau of Shaoxing City, Zhejiang province of the People's Republic of China (Grant No. 2015B70007).

语种：英文

外文关键词：Epoxy resin; Curing system; Moderate temperature prepreg; DSC; FTIR

外文摘要：Bisphenol A epoxy resin and an acid anhydride [chosen from methyltetrahydrophthalic anhydride (Me-THPA), methylhexahydrophthalic anhydride (MHHPA) and methyl nadic anhydride (MNA)] were used to prepare epoxy films for hot melt prepreg. The effects of film composition, i.e. type and amount of epoxy resin, curing agent and curing catalyst, were investigated to develop a moderate temperature prepreg, and orthogonal experiments were used to investigate the effect of film composition on the curing behaviour of the epoxy resin film, and to determine the optimal formulation. The most favourable formulation film was cured at 100 degrees C for 2 h, and its curing degree was characterised by FTIR spectroscopy.